100% material declaration data sheet PQG100 pk121 (v1.3.1) october 19, 2006 material declaration data sheet average weight: 1.6 g component substance description cas# or description % of component use in product component weight/ substance weight (in grams) component % of total silicon die 0.03472 2.17% silicon 7440-21-3 100.00 0.03472 die attach material 0.00544 0.34% silver 7440-22-4 78.00 0.0042432 epoxy (ep) trade secret 22.00 0.0011968 mold compound 1.24624 77.89% epoxy resin (ep) trade secret 9.00 0.1121616 phenolic resin trade secret 7.00 0.0872368 carbon black 1333-86-4 0.50 0.0062312 silica 60676-86-0 82.50 1.028148 bismuth 7440-69-9 max 1.00 0.0124624 leadframe 0.2856 17.85% copper 7440-50-8 98.85 0.2823156 chromium 7440-47-3 0.30 0.0008568 tin 7440-31-5 0.25 0.000714 zinc 7440-66-6 0.60 0.0017136 leadframe plating 0.0024 0.15% silver 7440-22-4 100.00 0.0024 bond wire 0.00368 0.23% gold 7440-57-5 100.00 0.00368 ext. plating 0.02192 1.37 % tin 7440-31-5 100.00 0.02192 pk121 (v1.3.1) october 19, 2006 www.xilinx.com 1 ? 2006 xilinx, inc. all rights reserved. a ll xilinx trademarks, registered trademarks, patents, and di sclaimers are as listed a t http://www.xilinx.com/legal.htm . all other trademarks and registered trademarks are the property of their respective owners. all specifications are subject to c hange without notice. xilinx believes this environmental information to be correct, but cannot guarantee its completeness or accuracy as it is based on data received from sources outside our company.
100% material declaration data sheet ? PQG100 2 www.xilinx.com revision history the following table shows the revi sion history for this document. date revision revision 3/08/06 1.0 initial release. 6/08/06 1.1 100% material declaration. 8/16/06 1.2 corrected all weight values. 9/28/06 1.3 updated component descriptions. 10/19/06 1.3.1 editorial c hange; corrected typo in substance description. pk121 (v1.3.1) october 19, 2006
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